by Ron Demcko, KYOCERA AVX, Fountain Inn, S.C., How2Power Today, May 15 2025
Focus:
Capacitors have been evolving for 100 years or more. From a 0.1-µF capacitor in 3 cc of
volume in the vacuum tube era to an 0201 10-uF multilayer ceramic capacitor (MLCC) in 5.5
x 10-5 cc today, capacitors have shrunk by orders of magnitude. This article discusses the
market and technology trends that have been driving down the size of MLCCs, and how the
low-profile MLCCs now available can be mounted in IC packages, and even embedded in IC
substrates and pc boards. The article describes the current state of the art in terms of
tiny cases sizes, height requirements for co-packaging and embedding of caps, and
capacitance values currently available in those heights. Other low-height alternative such
as silicon and MOS, and single-layer ceramics, are also discussed. This discussion is
geared toward capacitors used in on-board power delivery.
What you’ll learn:
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