by André Christmann and David Levett, Infineon Technologies North America, El Segundo, Calif., How2Power Today, Jul 15 2017
Focus:
The development of EV drive trains for private-car and commercial, construction and
agricultural vehicles is demanding reductions in the cost of drivetrain components
including power transistors/power modules used in EV traction inverters. This article
describes how improvements in IGBT device design and module packaging associated with
Infineon’s EDT2 IGBT/diode chipset and its HybridPACK Drive package enable reductions
in switching and conduction losses, greater ability to withstand thermal stresses, and
use of smaller, lighter baseplates. In the targeted EV applications, these
improvements can be leveraged either to create IGBT modules with smaller size or
higher current rating.
What you’ll learn:
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