by Timothy Hegarty, Texas Instruments, Phoenix, Ariz., How2Power Today, Jun 15 2018
Focus:
The circuit schematic and PCB are pivotal to achieving excellent EMI performance. Part 3
underscored the need to minimize “power loop” parasitic inductance through component selection
and PCB layout. The power converter IC has an outsized impact here, in terms of its package
technology and EMI-specific features. As outlined in part 2, differential-mode filtering is
mandatory to reduce the input ripple current amplitude for EMI regulatory compliance.
Meanwhile, common-mode filtering is generally required to curtail emissions above approx. 10
MHz and shielding also offers excellent results at high frequencies. This article delves into
all these aspects, offering practical examples and guidelines (particularly with regard to PCB
layout) to mitigate EMI, specifically for converter solutions with integrated power MOSFETs and
controller.
What you’ll learn:
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