Increasing Power Density In Three-Phase Inverters With Direct-Cooled SiC Power Modules

by Matthew Feurtado, Matt Reeves, Daniel Martin, and Ty McNutt, Wolfspeed, Fayetteville, Ark. and Wieland Microcool, Bend, Ore., How2Power Today, Oct 15 2020

Focus:
Wolfspeed’s XM3 half-bridge power module with direct-cooled baseplate optimizes the performance of the company’s third-generation SiC MOSFETs. The direct-cooled baseplate integrates liquid cooling, which improves thermal performance and enables greater power delivery than the conventional flat baseplate version, which attaches to a liquid-cooled heatsink. In this article, the characteristics of both module types are described and the performance and manufacturing benefits of the direct-cooled modules versus the flat- baseplate module are explained and demonstrated. The improved performance of the direct- cooled module is verified experimentally and the different methods of measuring the junction temperature are noted. The system-level advantages of the direct-cooled module are then demonstrated in a three-phase inverter design example, which uses an 800-V bus like that used in electric vehicle applications.

What you’ll learn:

• How to improve the cooling performance and power density of half-bridge SiC power modules using a baseplate with integrated liquid cooling
• How to increase the power output capability of SiC half-bridge modules in EV applications

View this Source (requires a PDF Viewer installed on your device)

• Return to Search Result
• Start Another Search
• How2Power Home
• How2Power Full Website