by Charles E. Hymowitz, Paul Ho and Michael LaNovara, AEi Systems, Centennial, Colo. , How2Power Today, Nov 15 2024
Focus:
In today’s power integrity (PI) simulations picohenries matter. Timely availability,
fidelity, and model accuracy matter. However, vendor-supplied component models, including
those available for passive and other components, are often inaccurate or not available.
For system designers performing PI simulations, the answer to this problem is either to
obtain better models from third-party sources or to build their own measurement-based
models. This second option has been made easier by the new Curve-Fitting–Simulation Model
generation feature in the Bode Analyzer software Suite (BAS). The BAS software drives the
popular OMICRON Lab Bode 100 and 500 vector network analyzers (VNAs) and with the new
model generation feature, this software can curve fit the data from impedance measurements
to create lumped element models (SPICE). This article explains step-by-step how to use
“Circuit Fit/SPICE Modeling feature” and then presents examples using a set of capacitors,
a power inductor, and a ferrite bead.
What you’ll learn:
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