Tackling the Challenges of Power Dissipation

by Bonnie C. Baker, Applications Engineering Manager, Microchip Technology Inc., Chandler, Ariz., Power Electronics Technology, Apr 01 2004

Focus:
Simple calculations and measurements permit small outline IC packages to handle high currents

What you’ll learn:

• How to simply evaluate thermal performance of power ICs in small packages such as DFNs
• How to maximize current delivery from voltage regulator ICs in DFNs
• How to understand how thermal resistance specifications are derived for DFN packages

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