MOSFET Packaging Boosts Current Density

by Carl Blake and George Scheulein, International Rectifier, El Segundo, Calif., Power Electronics Technology, May 01 2004

Focus:
When applied in voltage regulator down (VRD) design (an embedded dc-dc converter design) in Intel's BTX form factor, DirectFET MOSFETs can exploit top-side cooling to deliver a current density of 50A/cubic inch.

What you’ll learn:

• How to exploit improvements in MOSFET packaging to build a high-current, multi-phase buck converter
• How to gauge performance benefits of DirectFET packaging versus standard SO-8s or DPaks

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