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Power Modules for Electric and Hybrid Vehicles

by Dr. Arendt Wintrich, Application Manager SEMIKRON, Bodo's Power Systems, Feb 01 2009

Focus:
This article discusses the characteristics and benefits of Semikron's SKiMR power module family as they relate to electric and hybrid vehicle applications. These solderless power modules package the IGBTs and temp sensors in half-bridge configurations along with the gate drivers required for three-phase inverter circuits with output power levels ranging from 30 kW to 150 kW. The power modules eliminate the requirement for copper baseplates by using pressure contacts to connect a module's DCB substrate to an external heat sink. Elimination of the baseplate reduces the thermal resistance and improves the thermal cycling performance of the modules, and enables higher power density in the modules. The modules' construction and performance characteristics, particularly thermal and switching characteristics, are described.

What you’ll learn:

Notes:
Article appears on pages 22-24 of February issue in article archive. You must register to access articles in this magazine's archive.

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