RoHS and Power MOSFETs: An Evolving Standard Influences Package Selections Now And In The Future

by Brian LaValle, International Rectifier, El Segundo, Calif., How2Power Today, Jan 16 2014

Focus:
Most engineers know that the Restriction of Hazardous Substances, or RoHS, prohibits the use of lead (Pb) in electronic components and this has driven a changeover to Pb-free solder throughout the industry. But many engineers may not be aware that the current version of this directive includes an exemption for the use of Pb-based solder within semiconductor packages. Some existing power MOSFET packages like DPak, D2Pak and PQFNs take advantage of this exemption because suppliers have not yet come up with a Pb-free alternative for die attach in these packages. However, with the exemption allowing Pb inside the package due to expire in two years, some are wondering how to address this issue. In this 9- minute video, Brian LaValle discusses the technical and compliance issues surrounding the use of Pb in power semiconductor packages. He assesses the status of existing power MOSFET packages with respect to the current and pending versions of RoHS, describes an existing proprietary package that complies with both versions of the standard, and offers general guidance on how designers can address requirements for fully lead-free power MOSFET packaging in the long term.

What you’ll learn:

• How to understand the potential impact that RoHS 6 will have on power MOSFET packaging
• How to meet pending RoHS requirements for a fully lead-free (Pb-free) power MOSFET

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