PQFN With Ribbon Bond Boosts Power MOSFET Performance While Reducing System Cost For Automotive Applications
by Jifeng Qin, International Rectifier, El Segundo, Calif. , How2Power Today, Aug 15 2014
Focus:
Developers of automotive electrical systems are driven to improve their efficiency/power density and cost to ensure that they keep pace with industry needs. One of the tools designers rely on to meet these requirements are power MOSFETs. This article discusses the advantages of the PQFN package versus the more-established automotive-qualified MOSFET packages, namely the DPAK, D2PAK and SO-8, and introduces International Rectifier’s (IR) version of the PQFN, a 5 x 6-mm PQFN, which replaces wirebonds or copper clips with a ribbon bond. In comparing the different packages, issues such as power density, package resistance, cost and inspection capability are highlighted. The article also cites some example MOSFET devices in the new IR package and identifies their target applications.
What you’ll learn:
- How to understand the benefits of PQFN packages for MOSFETs targeting automotive applications
- How to understand what applications are driving up demands for electrical energy in cars
- How to improve power density in automotive power converters
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