Liquid Cooling for High-Power Electronics

by Javier Valenzuela, President, Thomas Jasinski, Director of Thermal Systems, and Zahed Sheikh, Vice President of Business Development, Mikros Technologies, Claremont, N.H., Power Electronics Technology, Feb 01 2005

Focus:
A common approach to cooling high-power IGBT modules is to attach a modules to heat spreader which is then mounted to a cold plate using a thermal interface material. However, the thermal resistivities of the thermal interface material and the heat spreader represent a bottleneck to cooling and limit the power dissipation that can be allowed for the IGBT die. A novel micro-channel cold plate with low core resistivity and the ability to be directly bonded to a DBC substrate allows IGBT modules to achiever greater power dissipation by removing in excess of 1000W/cm2.

What you’ll learn:

• How to improve cooling of IGBT modules by improving cold-plate performance
• How to improve cold-plate cooling for next-generation (SiC and GaN) power semiconductors

View this Source (requires a PDF Viewer installed on your device)

• Return to Search Result
• Start Another Search
• How2Power Home
• How2Power Full Website